Microstructuring of dual damascene opening by hot embossing combined with etch-back process

Japanese Journal of Applied Physics

Volumn 47, Issue 6 PART 2, 2008, Pages 5189-5196

  Youn, Sung Won ^a   Ueno, Akihisa ^a   Takahashi, Masaharu ^a   Maeda, Ryutaro ^a  

^a NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

Author keywords

Dual damascene opening; Etch back removal; Hot embossing; Poly(chloro p xylylene) (parylene C); Residual thickness

Indexed keywords

ETCHING; MOLDS; NANOIMPRINT LITHOGRAPHY; SILICON; TABLE LOOKUP;

DUAL DAMASCENE OPENING; ETCH-BACK REMOVAL; HOT EMBOSSING; POLY(CHLORO-P- XYLYLENE) (PARYLENE-C); RESIDUAL THICKNESS;

REACTIVE ION ETCHING;

EID: 55049137719     PISSN: 00214922     EISSN: 13474065     Source Type: Journal    
DOI: 10.1143/JJAP.47.5189     Document Type: Article

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