A quantitative adhesion study between contacting materials in Cu damascene structures

Applied Surface Science

Volumn 201, Issue 1-4, 2002, Pages 20-34

  Lanckmans, F ^a,b   Brongersma, S H ^a   Varga, I ^a   Poortmans, S ^a   Bender, H ^a   Conard, T ^a   Maex, K ^b  

^a IMEC   (Belgium)

^b UNIVERSITY OF LEUVEN   (Belgium)

Author keywords

Cu low k integration; Damascene; Quantitative adhesion technique

Indexed keywords

ADHESION; COPPER; DIFFUSION; FINITE ELEMENT METHOD; INTERFACES (MATERIALS); POROSITY; SHEAR STRESS;

DAMASCENE TECHNOLOGY;

SURFACE STRUCTURE;

EID: 0037202575     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0169-4332(02)00287-8     Document Type: Article

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