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Volumn 44, Issue 11, 2005, Pages 7876-7882

Fundamental properties of organic low-k dielectrics usable in the Cu damascene process

Author keywords

Chemical mechanical polishing; Cu damascene process; Electrical property evaluation; Interlayer dielectric; Organic low k dielectrics

Indexed keywords

CHEMICAL MECHANICAL POLISHING; FOURIER TRANSFORM INFRARED SPECTROSCOPY; PERMITTIVITY; SCANNING ELECTRON MICROSCOPY; THERMOPLASTICS; THERMOSETS;

CU DAMASCENE PROCESS; INTERLAYER DIELECTRIC; ORGANIC LOW K-DIELECTRICS;

DIELECTRIC MATERIALS;

EID: 31544482389 PISSN: 00214922 EISSN: 13474065 Source Type: Journal
DOI: 10.1143/JJAP.44.7876 Document Type: Article

Times cited : (5)

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