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Volumn 17, Issue 6, 2007, Pages 889-897

Copper/pohimide heterojunctions: Controlling interfacial structures through an additive-based, all-wet chemical process using ion-doped precursors

Author keywords

[No Author keywords available]

Indexed keywords

HYDROLYSIS; IONS; METALLIZING; POLYIMIDES; SEMICONDUCTOR DOPING; SURFACE STRUCTURE; THIN FILMS;

EID: 34248570480     PISSN: 1616301X     EISSN: 16163028     Source Type: Journal    
DOI: 10.1002/adfm.200600527     Document Type: Article
Times cited : (62)

References (39)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.