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Journal of Materials Chemistry

Volumn 18, Issue 42, 2008, Pages 5078-5082

Direct metallization of nickel on polymeric template patterns for fabrication of copper circuits on glass substrates

(5) Matsumura, Yasufumi a,b Enomoto, Yasushi b Sugiyama, Masanori a Akamatsu, Kensuke a Nawafune, Hidemi a

a KONAN UNIVERSITY (Japan)

b NIPPON STEEL CORPORATION (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ABS RESINS; ACIDS; CHEMICAL REACTIONS; COPPER; FABRICATION; GLASS; ION EXCHANGE; IONS; METALLIC GLASS; METALLIZING; NETWORKS (CIRCUITS); NICKEL; NICKEL ALLOYS; NITROGEN COMPOUNDS; POLYMERIC GLASS; THICK FILMS;

ADHESIVE INTERLAYERS; AQUEOUS; CHEMICAL ROUTES; CIRCUIT PATTERNS; EXPERIMENTAL DATUM; GLASS SUBSTRATES; GLASS SURFACES; GRANULAR LAYERS; GROWTH PROCESSES; ION DOPING; LAYERED STRUCTURES; METALLIC THIN FILMS; METALLIZATION; METALLIZATION PROCESSES; NOVEL FABRICATION PROCESSES; POLY(AMIC ACID); POLYMERIC TEMPLATES; REDUCTION TREATMENTS;

SUBSTRATES;

EID: 54249123118 PISSN: 09599428 EISSN: 13645501 Source Type: Journal
DOI: 10.1039/b808267g Document Type: Article

Times cited : (21)

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