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Volumn 42, Issue 5, 2001, Pages 809-813

Prediction of thermal fatigue life of lead-free BGA solder joints by finite element analysis

Author keywords

Finite element method; Lead free solder; Micro ball grid array; Solder joint; Thermal fatigue life

Indexed keywords

COMPUTER SIMULATION; FATIGUE OF MATERIALS; FATIGUE TESTING; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; STRAIN; STRESS ANALYSIS; THERMAL CYCLING;

EID: 0034932919     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.42.809     Document Type: Article
Times cited : (10)

References (15)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.