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Volumn 42, Issue 5, 2001, Pages 809-813
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Prediction of thermal fatigue life of lead-free BGA solder joints by finite element analysis
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Author keywords
Finite element method; Lead free solder; Micro ball grid array; Solder joint; Thermal fatigue life
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Indexed keywords
COMPUTER SIMULATION;
FATIGUE OF MATERIALS;
FATIGUE TESTING;
FINITE ELEMENT METHOD;
MATHEMATICAL MODELS;
STRAIN;
STRESS ANALYSIS;
THERMAL CYCLING;
LEAD FREE SOLDER;
MICRO BALL GRID ARRAY;
THERMAL FATIGUE LIFE;
SOLDERED JOINTS;
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EID: 0034932919
PISSN: 13459678
EISSN: None
Source Type: Journal
DOI: 10.2320/matertrans.42.809 Document Type: Article |
Times cited : (10)
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References (15)
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