Thermal fatigue performance of Sn-Ag-Cu chip-scale package with underfill

Materials Science and Engineering: A

Volumn 483-484, Issue 1-2 C, 2008, Pages 464-468

  Noh, Bo In ^a   Lee, Bo Young ^b   Jung, Seung Boo ^a  

^a Sungkyunkwan University   (South Korea)

^b Hankuk Aviation University   (South Korea)

Author keywords

Chip scale package; Coefficient of thermal expansion; Glass transition temperature; Thermal shock; Underfill

Indexed keywords

CHIP SCALE PACKAGES; GLASS TRANSITION; INTERFACES (MATERIALS); INTERMETALLICS; TEMPERATURE; THERMAL EXPANSION; THERMAL FATIGUE;

SOLDER JOINTS; THERMAL SHOCK TEST;

TIN ALLOYS;

CHIP SCALE PACKAGES; GLASS TRANSITION; INTERFACES (MATERIALS); INTERMETALLICS; TEMPERATURE; THERMAL EXPANSION; THERMAL FATIGUE; TIN ALLOYS;

EID: 41849093408     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2006.12.187     Document Type: Article

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