Underfill selection methodology for fine pitch Cu/low-k FCBGA packages

Microelectronics Reliability

Volumn 49, Issue 2, 2009, Pages 150-162

  Ong, Xuefen ^a,b,c   Ho, Soon Wee ^a   Ong, Yue Ying ^a   Wai, Leong Ching ^a   Vaidyanathan, Kripesh ^a   Lim, Yeow Kheng ^b   Yeo, David ^b   Chan, Kai Chong ^b   Tan, Juan Boon ^b   Sohn, Dong Kyun ^b   Hsia, Liang Choo ^b   Chen, Zhong ^c  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

^b CHARTERED SEMICONDUCTOR MANUFACTURING LTD   (Singapore)

^c NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

DIES; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING;

COEFFICIENT OF MOISTURE EXPANSIONS; DIE SIZES; EVALUATION FACTORS; FCBGA PACKAGES; FINE PITCHES; FLIP-CHIP BALL GRID ARRAYS; FLOWABILITY; LARGE SIZES; PACKAGE FAILURES; PACKAGE SIZES; SELECTION SCHEMES; TARGET VALUES; UNDERFILL; UNDERFILL ENCAPSULANTS; UNDERFILL MATERIALS; UNDERFILL PROPERTIES;

FRACTURE TOUGHNESS;

EID: 59349106597     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2008.11.015     Document Type: Article

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