3D fracture mechanics analysis of underfill delamination for flip chip packages

2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, I-THERM

Volumn , Issue , 2008, Pages 751-755

  Zhang, Zhen ^a   Zhai, Charlie J ^a   Master, Raj N ^a  

^a ADVANCED MICRO DEVICES   (United States)

Author keywords

3D; Delamination; FEA; Underfill

Indexed keywords

CHIP SCALE PACKAGES; COPPER; CRACKS; DELAMINATION; DIES; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS ENGINEERING; FAILURE ANALYSIS; FIGHTER AIRCRAFT; FLIP CHIP DEVICES; FORMING; FRACTURE MECHANICS; HEATING EQUIPMENT; SILICON; SPEED; SPREADERS; STEEL SHEET; STRENGTH OF MATERIALS; STRESSES; THERMAL CONDUCTIVITY; THERMAL SPRAYING; THERMAL STRESS; THERMOMECHANICAL TREATMENT; THREE DIMENSIONAL;

3D; FEA; UNDERFILL;

THERMAL EXPANSION;

EID: 50949097328     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2008.4544343     Document Type: Conference Paper

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