SCOPUS 정보 검색 플랫폼

Journal of Electronic Materials

Volumn 31, Issue 4, 2002, Pages 253-264

Underfill constraint effects during thermomechanical cycling of flip-chip solder joints

(3) Dutta, I a Gopinath, A a Marshall, C a

a Naval Postgraduate School ^* (United States)

Author keywords

Coarsening; Constraints; Flip chip; Solder; Thermomechanical cycling; Underfill

Indexed keywords

DEFORMATION; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; MATHEMATICAL MODELS; MICROSTRUCTURE; SUBSTRATES; THERMOMECHANICAL TREATMENT;

UNDERFILL CONSTRAINT EFFECTS;

SOLDERED JOINTS;

EID: 0036539629 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-002-0141-4 Document Type: Article

Times cited : (44)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.