Time and temperature-dependent mechanical behavior of underfill materials in electronic packaging application

Microelectronics Reliability

Volumn 44, Issue 4, 2004, Pages 627-638

  Kuo, Chia Tai ^a   Yip, Ming Chuen ^a   Chiang, Kuo Ning ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; COMPUTER SIMULATION; CREEP; DEFORMATION; DIFFUSION; ELASTIC MODULI; INTERFACES (MATERIALS); ISOTHERMS; MICROELECTROMECHANICAL DEVICES; MOISTURE; STRAIN; STRESSES; THERMOMECHANICAL TREATMENT;

BALL ARRAY PACKAGES; TEMPERATURE DEPENDENT MECHANICAL BEHAVIORS;

ELECTRONICS PACKAGING;

EID: 1542401172     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2003.10.005     Document Type: Article

References (19)

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