Influence of underfill materials on the reliability of coreless flip chip package

Microelectronics Reliability

Volumn 48, Issue 11-12, 2008, Pages 1875-1881

  Chuang, Chun Chih ^a   Yang, Tsung Fu ^a   Juang, Jin Ye ^a   Hung, Yin Po ^a   Zhan, Chau Jie ^a   Lin, Yu Min ^a   Lin, Ching Tsung ^a   Chang, Pei Chen ^a   Chang, Tao Chih ^a  

^a INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

BRAZING; COPPER; ELECTRIC BATTERIES; FLIP CHIP DEVICES; MOISTURE; POLYIMIDES; POLYMERS; RELIABILITY; SILVER; SOLDERING; SOLDERING ALLOYS; SUBSTRATES; TIN; WELDING;

DIE CRACKS; FLIP CHIPS; HIGH TEMPERATURE STORAGE TESTS; HIGH TEMPERATURES; HIGHLY ACCELERATED STRESS TESTS; KEY FACTORS; PEAK TEMPERATURES; SN-37PB; SOLDER BALLS; SOLDER BUMPS; SOLDER JOINTS; STORAGE TESTS; TEMPERATURE CYCLE TESTS; UNDERFILL; UNDERFILL MATERIALS; VOLUME PRODUCTIONS; WARPAGE; YOUNG'S MODULES;

TESTING;

EID: 55649099019     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2008.09.005     Document Type: Article

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