Reliability and failure mode analysis of no flow underfill materials for low cost flip chip assembly

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2000, Pages 1719-1730

  Smith, Brian S ^a   Thorpe, Ryan ^a   Baldwin, Daniel F ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK PROPAGATION; DELAMINATION; FAILURE ANALYSIS; FATIGUE OF MATERIALS; INTERFACES (MATERIALS); METALLIZING; RELIABILITY; SEMICONDUCTOR DEVICE TESTING; THERMAL CYCLING;

CHIP SIZE; SOLDERMASK OPENING DESIGN; UNDERFILL ARE PROCESS; UNDERFILL FLOW PROCESS;

FLIP CHIP DEVICES;

EID: 0034476758     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)