Thermomechanical durability analysis of flip chip solder interconnects: Part 2-with underfill

Journal of Electronic Packaging, Transactions of the ASME

Volumn 121, Issue 4, 1999, Pages 237-241

  Darbha, K ^a   Okura, J H ^a   Shetty, S ^a   Dasgupta, A ^a   Reinikainen, T ^b   Zhu, J ^b   Caers, J F J M ^c  

^a UNIVERSITY OF MARYLAND   (United States)

^b NOKIA RESEARCH CENTER   (United States)

^c PHILIPS RESEARCH LABORATORIES   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0346838211     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2793846     Document Type: Article

References (12)

1. ABAQUS, 1997, Version 5.7, Theory and Users Manual, Hibbitt, Karlsson & Sorenson, Inc., RI.
2. Baggerman, A. F. J., Caers, J. F. J. M., Wondergem, J. J., and Wagemans, A. G., 1996, “Low-Cost Flip-Chip on Board,” IEEE Transactions on Components, Packaging and Manufacturing Technology—Part B, Vol. 19, No. 4, pp. 736-746.
3. Darbha, K., Okura, J. H., Dasgupta, A., and Caers, J. F. J. M., 1997, “Thermomechanical Durability Analysis of Flip Chip Solder Interconnects Without Underfill,” Proceedings, ASME Winter Annual Conference: 9th Symposium on Mechanics of Surface Mount Assemblies, November 1997, Dallas, TX.
4. Dasgupta, A., Oyan, C., Barker, D., and Pecht, M., 1992, “Solder Creep-Fatigue Analysis by an Energy-Partitioning Approach,” ASME Journal of Electronic Packaging, Vol. 114, pp. 152-160.
5. Doi, H., Kawano, K., and Yasukawa, A., 1997, “Reliability of Underfill-Encapsulated Flip-Chip Packages,” Proceedings, Application of Fracture Mechanics in Electronic Packaging, AMD-Vol. 222/EEP-Vol. 20, ASME, New York.
6. Doi, K., Hirano, N., Okada, T., Hiruta, Y., Sudo, T., and Mukai, M., 1996, “Prediciton of Thermal Fatigue for Encapsulated Flip Chip Interconnection,” Microcircuits and Electronic Packaging, Vol. 19, No. 3, pp. 231-237.
7. Le Gall, A. C., Qu, J., and McDowell, D., 1997, “Some Mechanics Issues Related to the Thermomechanical Reliability of Flip Chip DCA With Underfill Encapsulation,” Proceedings, ASME Symposium on Application of Fracture Mechanics in Electronic Packaging, AMD-Vol. 222/EEP-Vol. 20, pp. 85-95.
8. Okura, J. H., Darbha, K., Dasgupta, A., 1998, “Effect of Underfill in Flip Chip on Board Assemblies,” paper presented at the ASME Winter Annual Conference, 1998, Anahein, CA.
9. Ramakrishna, K., and Johnson, Z., 1997, “Effect of Material and Design Parameters on the Stresses Induced in a Direct-Chip-Attach Package During Underfill Cure,” ASME InterPACK’97, EEP-Vol. 19-2, ASME, New York, pp. 1639-1646.
10. Steinberg, D. S., 1988, Vibration Analysis for Electronic Equipment, John Wiley & Sons, New York.
11. Wang, J., Qian, Z., and Liu, S., 1998, “Process Induced Stresses of a Flip Chip Packaging by Sequential Processing Modeling Technique,” ASME Journal of Electronic Packaging, Vol. 120, pp. 309-313.
12. Wong, T. E., 1998, personal communication.