Measurements of solder bump lifetime as a function of underfill material properties

IEEE International Symposium on Polymeric Electronics Packaging, PEP

Volumn , Issue , 1997, Pages 307-314

  Nysaether, Jon B ^a   Lundstrom, Pontus ^a   Liu, Johan ^a  

^a UNIVERSITY OF OSLO   (Norway)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTATIONAL METHODS; FAILURE ANALYSIS; FILLERS; FLIP CHIP DEVICES; MATHEMATICAL MODELS; SERVICE LIFE; SOLDERING; STRAIN; THERMAL CYCLING; THERMAL EXPANSION;

AXIAL STRAIN; SHEAR STRAIN; SOLDER BUMPS; THERMAL EXPANSION COEFFICIENTS; UNDERFILLERS;

ELECTRONICS PACKAGING;

EID: 0031361009     PISSN: 14029855     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (19)