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Journal of Materials Chemistry

Volumn 20, Issue 18, 2010, Pages 3600-3609

Modification of Cu nanoparticles with a disulfide for polyimide metallization

(4) Dow, Wei Ping a Liao, Guo Liang a Huang, Shang En a Chen, Sinn Wen b

a NATIONAL CHUNG HSING UNIVERSITY (Taiwan)

b NATIONAL TSING HUA UNIVERSITY (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVITY ENHANCEMENT; BIS(3-SULFOPROPYL)DISULFIDE; CHEMICAL ACTIVITIES; COPPER ATOMS; COPPER LAYER; COPPER METALLIZATION; COPPER NANOPARTICLES; CROSS SECTIONAL TRANSMISSION ELECTRON MICROSCOPY; CU NANOPARTICLES; DIMETHYLAMINE BORANES; ELECTROLESS COPPER; FIELD EMISSION SCANNING ELECTRON MICROSCOPY; FOURIER TRANSFORM INFRARED SPECTROMETRY; HYDROGEN GAS; METALLIZATIONS; ORGANIC ADDITIVES; POLYAMIC ACIDS; POLYIMIDE FILM; REDUCTANTS; TEM; UV-VISIBLE SPECTROPHOTOMETRY; WET CHEMICAL PROCESS; X-RAY PHOTOELECTRONS; XPS;

AGGLOMERATION; ATOMIC FORCE MICROSCOPY; ATOMS; COPPER; FIELD EMISSION; FIELD EMISSION MICROSCOPES; FOURIER TRANSFORM INFRARED SPECTROSCOPY; ION EXCHANGE; METALLIZING; NANOPARTICLES; POLYIMIDES; POLYMERIC FILMS; SPECTROMETRY; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION;

SCANNING ELECTRON MICROSCOPY;

EID: 77951789009 PISSN: 09599428 EISSN: 13645501 Source Type: Journal
DOI: 10.1039/b920626d Document Type: Article

Times cited : (36)

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