A wet process for forming an adhesive copper layer on polyimide film

Electrochemistry

Volumn 76, Issue 3, 2008, Pages 191-196

  Osaka, Tetsuya ^a,b   Wakatsuki, Satoshi ^b   Masuda, Toyoto ^a   Yoshino, Masahiro ^a   Yamachika, Noriyuki ^b   Sasano, Junji ^a   Matsuda, Itsuaki ^a   Okinaka, Yutaka ^a  

^a WASEDA UNIVERSITY   (Japan)

^b School of Science and Engineering   (Japan)

Author keywords

Adhesion strength; Organic layer; Polyimide; Wet process

Indexed keywords

BOND STRENGTH (MATERIALS); CATALYSIS; COPPER; ELECTROLESS PLATING; LIGANDS;

AMINOPROPYL-TRIETHOXY SILANE (APTES); BARRIER LAYERS;

POLYIMIDES;

EID: 42349107595     PISSN: 13443542     EISSN: None     Source Type: Journal    
DOI: 10.5796/electrochemistry.76.191     Document Type: Article

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