A study on the interracial composition of the electroless-copper-plated BPDA-PDA polyimide sheet

Journal of Materials Chemistry

Volumn 13, Issue 4, 2003, Pages 818-824

  Yu, W X ^a,d   Hong, L ^a   Chen, B H ^b   Ko, T M ^c  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

^b NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^c IBM MICROELECTRONICS   (United States)

^d Hewlett Packard Singapore (Private) Limited   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL MODIFICATION; COMPOSITION; COPPER PLATING; ELECTROLESS PLATING; PLASTIC SHEETS; REACTION KINETICS; THIN FILMS; X RAY PHOTOELECTRON SPECTROSCOPY;

RING-OPENING REACTIONS;

POLYIMIDES;

ACID; ALKALI; COPPER; COPPER ION; IMIDE; POLY(BIPHENYL DIANHYDRIDE 4 PHENYLENEDIAMINE); POLYIMIDE; UNCLASSIFIED DRUG;

ACIDIFICATION; ARTICLE; ATOMIC FORCE MICROSCOPY; CATALYSIS; CHEMICAL COMPOSITION; CHEMICAL MODIFICATION; FILM; FILTRATION; MATERIAL COATING; SURFACE PROPERTY; TECHNIQUE; X RAY PHOTOELECTRON SPECTROSCOPY;

EID: 0037383215     PISSN: 09599428     EISSN: None     Source Type: Journal    
DOI: 10.1039/b208102d     Document Type: Article

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