Plasma surface modification of polyimide for improving adhesion to electroless copper coatings

Journal of Adhesion Science and Technology

Volumn 10, Issue 5, 1996, Pages 399-406

  Rozovskis, G ^a   Vinkevicius J ^a   Jaciauskiene J ^a  

^a CENTER FOR PHYSICAL SCIENCES AND TECHNOLOGY   (Lithuania)

Author keywords

Adhesion; Chemical etching; Electroless copper; Plasma treatment; Polyimide

Indexed keywords

BOND STRENGTH (MATERIALS); COATING TECHNIQUES; COATINGS; COPPER; ELECTROLESS PLATING; MORPHOLOGY; OXYGEN; PLASMA ETCHING; POLYIMIDES; SURFACE TREATMENT; SURFACES; X RAY PHOTOELECTRON SPECTROSCOPY; ALKALINITY; METAL COATINGS; PLASMA APPLICATIONS; SURFACE MORPHOLOGY;

ELECTROLESS COPPER COATINGS; PERMANGANATE; PLASMA SURFACE MODIFICATION; REEL STRENGTH;

ADHESION;

ALKALINE SOLUTIONS; CHEMICAL COMPOSITIONS; CHEMICAL ETCHING; ELECTROLESS COPPER; ELECTROLESS COPPER COATINGS; FILM SURFACES; HIGHER TEMPERATURES; OPERATING PARAMETERS; OXYGEN CONTAINING GROUPS; OXYGEN CONTENT; OXYGEN PLASMA TREATMENTS; PEEL STRENGTH; PLASMA SURFACE MODIFICATIONS; PLASMA TREATMENT; POSITIVE EFFECTS; TREATMENT TIME;

EID: 0029699269     PISSN: 01694243     EISSN: 15685616     Source Type: Journal    
DOI: 10.1163/156856196X00490     Document Type: Article

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