Selective silver seeding on laser modified polyimide for electroless copper plating

Applied Surface Science

Volumn 246, Issue 1-3, 2005, Pages 167-173

  Chen, Dongsheng ^a   Li, Yi ^a   Lu, Qinghua ^a   Yin, Jie ^a   Zhu, Zikang ^a  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

Author keywords

Copper deposition; Electroless plating; Laser; Polyimide; Silver

Indexed keywords

DEPOSITION; ELECTROLESS PLATING; LASER ABLATION; LASER BEAM EFFECTS; POLYIMIDES; POSITIVE IONS; SCANNING ELECTRON MICROSCOPY; SILVER; SOLUTIONS; X RAY PHOTOELECTRON SPECTROSCOPY;

ELECTROLESS COPPER PLATING; LASER-INDUCED DEPOSITION; SELECTIVE DEPOSITION; SILVER SEEDING;

SURFACE CHEMISTRY;

EID: 17744398825     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apsusc.2004.11.005     Document Type: Article

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