Surface modification and metallization of polyimide using gold colloids as a seed layer

Journal of Applied Polymer Science

Volumn 111, Issue 4, 2009, Pages 2044-2048

  Kong, Yong ^a   Shao, Jianqun ^b   Wang, Wenchang ^a   Chen, Zhidong ^a   Chu, Haixia ^a  

^a CHANGZHOU UNIVERSITY   (China)

^b CAPITAL MEDICAL UNIVERSITY   (China)

Author keywords

Gold colloids; Metallization; Polyimide; Surface modification

Indexed keywords

ACIDS; AMINES; CARBOXYLIC ACIDS; COLLOID CHEMISTRY; CONTACT ANGLE; COPPER; FOURIER TRANSFORM INFRARED SPECTROSCOPY; FOURIER TRANSFORMS; GOLD; METALLIZING; ORGANIC ACIDS; ORGANIC COMPOUNDS; POLYMERS; POTASSIUM; POTASSIUM HYDROXIDE; RESINS; SURFACE TREATMENT;

ATTENUATED TOTAL REFLECTIONS; CARBOXYLIC ACID GROUPS; CHEMICALLY MODIFIED SURFACES; CHLOROAURIC ACIDS; CONDUCTIVE LAYERS; COPPER PARTICLES; ELECTROLESS; FOURIER TRANSFORM INFRARED; GOLD COLLOIDS; METALLIZATION; MODIFIED POLYIMIDES; POLYIMIDE; SECONDARY AMINES; SEED LAYERS; SEM IMAGES; SURFACE MODIFICATION; SURFACE-MODIFIED; TERTIARY AMINE GROUPS;

POLYIMIDES;

AMINE; CATALYST; COLLOID; ELECTROLESS PLATING; HYDROLYSIS; METALLIZATION; POLYIMIDE; SEED; SPECTROPHOTOMETRY; SURFACE MODIFICATION;

EID: 60349123554     PISSN: 00218995     EISSN: 10974628     Source Type: Journal    
DOI: 10.1002/app.29188     Document Type: Article

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