Chemical formation of palladium-free surface-nickelized polyimide film for flexible electronics

Thin Solid Films

Volumn 516, Issue 12, 2008, Pages 4258-4266

  Hsiao, Yu Sheng ^a   Whang, Wha Tzong ^a   Wu, Sheng Chang ^b   Chuang, Kuen Ru ^b  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

^b Taimide Technology Company   (Taiwan)

Author keywords

Flexible electronics; Nickel electroless deposition; Polyimide

Indexed keywords

ADHESION; ATOMIC FORCE MICROSCOPY; ELECTROLESS PLATING; HYDROLYSIS; ION EXCHANGE; POLYIMIDES; SCANNING ELECTRON MICROSCOPY;

ADHESIVE TAPE TESTING; FLEXIBLE ELECTRONICS; NICKEL ELECTROLESS DEPOSITION;

POLYMER FILMS;

EID: 40849106259     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2007.12.166     Document Type: Article

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