Electroless plating of copper on polyimide films modified by surface-initiated atom-transfer radical polymerization of 4-vinylpyridine

Applied Surface Science

Volumn 254, Issue 22, 2008, Pages 7331-7335

  Li, Liang ^a   Yan, Guoping ^a   Wu, Jiangyu ^a   Yu, Xianghua ^a   Guo, Qingzhong ^a   Kang, Entang ^b  

^a WUHAN INSTITUTE OF TECHNOLOGY   (China)

^b NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

4 Vinylpyridine; Copper; Electroless plating; Polyimide; Surface initiated ATRP

Indexed keywords

ADHESION; ATOMIC FORCE MICROSCOPY; BOND STRENGTH (MATERIALS); CHLORINE COMPOUNDS; COPPER; ELECTROLESS PLATING; FREE RADICAL REACTIONS; PALLADIUM COMPOUNDS; POLYIMIDES; POLYMERIZATION; SURFACE TREATMENT; TIN COMPOUNDS; X RAY PHOTOELECTRON SPECTROSCOPY;

4-VINYLPYRIDINE; 4-VINYLPYRIDINE (4VP); PALLADIUM COMPLEXES; PEEL ADHESION STRENGTH; POLY(4-VINYLPYRIDINE) (P4VP); POLYMERIZATION TIME; SURFACE INITIATED-ATOM TRANSFER RADICAL POLYMERIZATION; SURFACE-INITIATED ATRP;

ATOM TRANSFER RADICAL POLYMERIZATION;

EID: 50849115795     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apsusc.2008.05.327     Document Type: Article

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