Copper metallization of polymers by a palladium-free electroless process

Surface and Coatings Technology

Volumn 200, Issue 18-19, 2006, Pages 5478-5486

  Charbonnier, M ^a   Romand, Maurice ^a   Goepfert, Y ^a   Leonard D ^a   Bouadi, M ^b  

^a UNIVERSITÉ LYON 1   (France)

^b UNIVERSITY OF TIARET   (Algeria)

Author keywords

Adhesion; Copper; Cu direct electroless plating; Electroless deposition; Radio frequency (RF) plasma treatments; X ray photoelectron spectroscopy

Indexed keywords

ADHESION; ELECTROLESS PLATING; METALLIZING; PLASMA APPLICATIONS; POLYMERS; REDOX REACTIONS; X RAY PHOTOELECTRON SPECTROSCOPY;

COPPER METALLIZATION; RADIO FREQUENCY PLASMA TREATMENTS;

COPPER PLATING;

ADHESION; COPPER PLATING; ELECTROLESS PLATING; METALLIZING; PLASMA APPLICATIONS; POLYMERS; REDOX REACTIONS; X RAY PHOTOELECTRON SPECTROSCOPY;

EID: 33645122412     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2005.07.061     Document Type: Article

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