Adhesion interaction between electrolessly deposited copper film and polyimide

Journal of Adhesion Science and Technology

Volumn 11, Issue 2, 1997, Pages 167-182

  Vorobyova, T N ^a  

^a BELARUSIAN STATE UNIVERSITY   (Belarus)

Author keywords

Adhesion; Copper; Cu polyimide system; Interface; Microstructure; Polyimide

Indexed keywords

ADHESION INTERACTIONS; ALKALI SOLUTIONS; AMIDO GROUPS; COPPER FILMS; CU-POLYIMIDE SYSTEM; DONOR-ACCEPTOR INTERACTION; ELECTROLESS COPPER PLATING; METAL ION ADSORPTION; NANOMETRES; NEAR-SURFACE; PALLADIUM PARTICLES; PI FILM; SUBSTRATE SURFACE; TRANSITION REGIONS;

ADHESION; ADSORPTION; COPPER; COPPER OXIDES; COPPER PLATING; INTERFACES (MATERIALS); METAL IONS; MICROSTRUCTURE; PALLADIUM COMPOUNDS; POLYIMIDES; CHEMICAL ACTIVATION; COMPOSITION; DESORPTION; ELECTROLESS PLATING; IONS; MOLECULAR DYNAMICS; THICK FILMS;

TIN; ADHESION;

GLOBULE JUNCTIONS; TIN HYDROXO COMPOUNDS;

EID: 0030736454     PISSN: 01694243     EISSN: 15685616     Source Type: Journal    
DOI: 10.1163/156856197X00282     Document Type: Article

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