Evidence of aggregation-induced copper immobilization during polyimide metallization

Advanced Materials

Volumn 10, Issue 16, 1998, Pages 1357-1360

  Kiene, Michael ^a   Strunskus, Thomas ^a   Peter, Ralf ^a   Faupel, Franz ^a  

^a UNIVERSITY OF KIEL   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

AGGLOMERATION; ANNEALING; COPPER; CURING; DIFFUSION IN SOLIDS; EVAPORATION; GLASS TRANSITION; METALLIZING; POLYIMIDES; SILICON WAFERS; TRANSMISSION ELECTRON MICROSCOPY; X RAY PHOTOELECTRON SPECTROSCOPY;

POLYAMIC ACID; VOLMER-WEBER GROWTH;

PLASTIC FILMS;

EID: 0032207612     PISSN: 09359648     EISSN: None     Source Type: Journal    
DOI: 10.1002/(SICI)1521-4095(199811)10:16<1357::AID-ADMA1357>3.0.CO;2-9     Document Type: Article

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