Plasma treatment and surface analysis of polyimide films for electroless copper buildup process

Journal of the Electrochemical Society

Volumn 152, Issue 10, 2005, Pages

  Bhusari, Dhananjay ^a   Hayden, Harley ^a,c   Tanikella, Ravindra ^b   Allen, Sue Ann Bidstrup ^a,c   Kohl, Paul A ^a,c  

^a Georgia Institute of Technology   (United States)

^b INTEL CORPORATION   (United States)

^c ELECTROCHEMICAL SOCIETY

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; AMMONIA; CHEMICAL BONDS; CHEMICAL MODIFICATION; COPPER PLATING; ELECTROLESS PLATING; MORPHOLOGY; PALLADIUM; PLASMA APPLICATIONS; SURFACE ROUGHNESS;

ADHESION STRENGTH; CHEMICAL CHANGES; COVALENT BONDING; PHYSICAL MODIFICATIONS;

POLYIMIDES;

EID: 27644460348     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2006587     Document Type: Article

References (24)

1. Z. Wang, A. Furuya, K. Yasuda, H. Ikeda, T. Baba, M. Hagiwara, S. Toki, S. Shingubara, H. Kubota, and T. Ohmi, J. Adhes. Sci. Technol., 16, 1027 (2002).
2. S. Siau, A. Vervaet, E. Schacht, and A. Van Calster, J. Electrochem. Soc., 151, C133 (2004).
3. H. Okamura, T. Takahagi, N. Nagai, and S. Shingubara, J. Polym. Sci., Part B: Polym. Phys., 41, 2071 (2003).
4. N. Inagaki, S. Tasaka, and A. Onodera, J. Appl. Polym. Sci., 73, 1645 (1999).
5. Z. J. Yu, E. T. Kang, and K. G. Neoh, Polymer, 43, 4137 (2002).
6. J. Jang, I. Jang, and H. Kim, J. Appl. Polym. Sci., 68, 1343 (1998).
7. J. Seo, J. Kang, K. Cho, and C. Park, J. Adhes. Sci. Technol., 16, 1839 (2002).
8. H. D. Merchant, J. T. Wang, L. A. Giannuzzi, and Y. L. Liu, Circuit World, 26, 7 (2000).
9. R. F. Saraf, J. M. Roldan, and T. Derderian, IBM J. Res. Dev., 38, 441 (1994).
10. S. Iwamorei, T. Miyashita, S. Fukuda, S. Nozaki, K. Sudoh, and N. Fukuda, Vacuum, 51, 615 (1998).
11. F. D. Egitto and L. J. Matienzo, IBM J. Res. Dev., 38, 423 (1994).
12. Y. Nakamura, Y. Suzuki, and Y. Watanabe, Thin Solid Films, 290-291, 367 (1996).
13. A. M. Ektessabi and S. Hakamata, Thin Solid Films, 377-378, 621 (2000).
14. L. Zhang, T. Yasui, H. Tahara, and T. Yoshikawa, J. Appl. Phys., 86, 779 (1999).
15. R. Flitsch and D. Y. Shih, J. Adhes. Sci. Technol., 10, 1241 (1996).
16. C. Girardeaux, E. Druet, P. Demoncy, and M. Delamar, J. Electron Spectrosc. Relat. Phenom., 74, 57 (1995).
17. N. J. Chou, D. W. Dong, J. Kim, and A. C. Liu, J. Electrochem. Soc., 131, 2335 (1984).
18. L. Atanasoska, S. G. Anderson, H. M. Meyer III, and J. H. Weaver, Vacuum, 40, 85 (1990).
19. M. C. Burrell, P. J. Codella, J. A. Fontana, J. J. Chera, and M. D. McConnell, J. Vac. Sci. Technol. A, 7, 55 (1989).
20. J. Charlier, V. Detalle, F. Valin, C. Bureau, and G. Lecayon, J. Vac. Sci. Technol. A, 15, 353 (1997).
21. M. Charbonnier, M. Alami, and M. Romand, J. Electrochem. Soc., 143, 472 (1996).
22. G. Beamson and D. Briggs, High Resolution XPS of Organic Polymers, John Wiley & Sons, New York (1992).
23. W. J. Lee, Y. S. Lee, S. K. Rha, Y. J. Lee, K. Y. Lim, Y. D. Chung, and C. N. Whang, Appl. Surf. Sci., 205, 128 (2003).
24. T. N. Vorobyova, J. Adhes. Sci. Technol., 11, 167 (1997).