Microvia filling by Cu electroplating over a Au seed layer modified by a disulfide

Journal of the Electrochemical Society

Volumn 156, Issue 4, 2009, Pages

  Dow, Wei Ping ^a   Chiu, Yong Da ^a   Yen, Ming Yao ^a  

^a NATIONAL CHUNG HSING UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CHLORINE COMPOUNDS; ELECTROCHEMISTRY; ELECTROLYTES; ELECTROPLATING; FILLING;

ADLAYER; BIS(3-SULFOPROPYL)DISULFIDE (SPS); CHLORIDE IONS; COPPER ELECTRODEPOSITIONS; CU ELECTROPLATING; ELECTROCHEMICAL ANALYSIS; MICROVIA; MICROVIA FILLINGS; NUCLEATION AND GROWTHS; PLATING BATHS; PLATING PROCESS; PRE TREATMENTS; SEED LAYERS; SELF-ASSEMBLY MONOLAYERS; SUPPORTING ELECTROLYTES; THIOL MOLECULES; THIOLATE;

GOLD;

EID: 61349100773     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.3078407     Document Type: Article

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