Adsorption of the additives MPA, MPSA, and SPS onto Cu(111) from sulfuric acid solutions

Journal of the Electrochemical Society

Volumn 154, Issue 6, 2007, Pages

  Taubert C E ^a   Kolb, D M ^a,d   Memmert, U ^b   Meyer, H ^b,c  

^a UNIVERSITY OF ULM   (Germany)

^b ATOTECH DEUTSCHLAND GMBH   (Germany)

^c HMTC   (Germany)

^d ELECTROCHEMICAL SOCIETY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

3-MERCAPTOPROPIONIC ACID; BILAYER FORMATION; SULFATE-INDUCED RECONSTRUCTION;

ADDITIVES; ADSORPTION; COPPER PLATING; FILM GROWTH; SULFURIC ACID;

SULFUR COMPOUNDS;

EID: 34547155333     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2719611     Document Type: Article

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