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Volumn 217, Issue 5, 2003, Pages 479-491
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The influence of halide ions on the kinetics of electrochemical, copper(II) reduction
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Author keywords
Copper; Electrochemistry; Electroplating; Electrorefining; Halides; Mechanism
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Indexed keywords
BROMINE COMPOUNDS;
CHLORINE COMPOUNDS;
COPPER;
CYCLIC VOLTAMMETRY;
ELECTROCHEMISTRY;
ELECTRODES;
ELECTROLYTES;
ELECTROPLATING;
IONS;
MECHANISMS;
QUARTZ CRYSTAL MICROBALANCES;
REDUCTION;
SULFURIC ACID;
CATHODIC REDUCTIONS;
ELECTROCHEMICAL QUARTZ CRYSTAL MICROBALANCE;
ELECTRODE SURFACES;
ELECTROREFINING;
HALIDES;
NEGATIVE ELECTRODE;
SMALL CONCENTRATION;
TECHNICAL CONDITIONS;
COPPER COMPOUNDS;
BROMIDE;
CHLORIDE ION;
COPPER CHLORIDE;
COPPER ION;
COPPER SULFATE;
ELECTROLYTE;
HALIDE;
HALOGEN;
SULFUROUS ACID;
ADSORPTION;
ARTICLE;
CHEMICAL REACTION;
CYCLIC POTENTIOMETRY;
ELECTRIC POTENTIAL;
ELECTROCHEMISTRY;
ELECTRODE;
KINETICS;
REDUCTION;
SURFACE PROPERTY;
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EID: 0037617433
PISSN: 09429352
EISSN: None
Source Type: Journal
DOI: 10.1524/zpch.217.5.479.20457 Document Type: Article |
Times cited : (32)
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References (31)
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