Inhibition of copper deposition by polyethylene glycol and chloride: II. Analysis and application

Journal of the Electrochemical Society

Volumn 156, Issue 5, 2009, Pages

  Huerta Garrido, M E ^a   Pritzker, M D ^a  

^a UNIVERSITY OF WATERLOO   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

ADSORPTION; CHLORINE COMPOUNDS; COPPER; ETHYLENE GLYCOL; POLYETHYLENE OXIDES; THERMOPLASTICS;

ADDITIVE CONCENTRATIONS; ADSORPTION DENSITIES; CATHODIC SCANS; COMPREHENSIVE MODELS; COPPER DEPOSITIONS; CYCLIC SCANS; MEASURED CURRENTS; OVERPOTENTIAL;

POLYETHYLENE GLYCOLS;

EID: 63649161085     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.3089271     Document Type: Article

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