Polyether suppressors enabling copper metallization of high aspect ratio interconnects

Journal of the Electrochemical Society

Volumn 156, Issue 11, 2009, Pages

  Mendez, Julie ^a   Akolkar, Rohan ^b   Landau, Uziel ^a  

^a Case Western Reserve University   (United States)

^b INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITIVE SYSTEMS; BOTTOM-UP FILL; COPPER ELECTRODEPOSITION; COPPER METALLIZATION; FIRST-ORDER; HIGH ASPECT RATIO; INTERCONNECT GEOMETRY; POLARIZATION PARAMETERS; POLARIZATION STUDY; POLYOXYETHYLENE; SCALING MODEL; VOID-FREE;

ADDITIVES; ETHERS; ETHYLENE; ETHYLENE GLYCOL; PHENOLS; PHOTORESISTS; POLARIZATION; POLYETHYLENE GLYCOLS; POLYETHYLENE OXIDES; PRESSURE DROP;

ASPECT RATIO;

EID: 70349733213     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.3211849     Document Type: Article

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