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Journal of Materials Science: Materials in Electronics

Volumn 20, Issue 3, 2009, Pages 217-222

A SERS study of the galvanostatic sequence used for the electrochemical deposition of copper from baths employed in the fabrication of interconnects

(2) D'Urzo, Lucia a Bozzini, Benedetto a

a UNIVERSITY OF SALENTO (Italy)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRO-CHEMICAL DEPOSITION (ECD); GALVANOSTATIC; JOINT ACTIONS; POLYETHYLENE IMINE (PEI); PROCESS WINDOWS; REACTION PRODUCTS; SUB MICRON DIMENSIONS; SULPHATE; SURFACE ENHANCED RAMAN SCATTERING (SERS) SPECTRA;

ADSORPTION; CHLORINE COMPOUNDS; COPPER; ELECTRODEPOSITION; ETHYLENE GLYCOL; GLYCOLS; POLYETHYLENE GLYCOLS; POLYETHYLENE OXIDES; POLYETHYLENES; REDUCTION; SCANNING ELECTRON MICROSCOPY; SURFACES;

CATHODIC POLARIZATION;

EID: 58649094436 PISSN: 09574522 EISSN: 1573482X Source Type: Journal
DOI: 10.1007/s10854-008-9705-2 Document Type: Article

Times cited : (13)

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