Inhibition of copper deposition by polyethylene glycol and chloride: I. Model development and parameter estimation

Journal of the Electrochemical Society

Volumn 156, Issue 1, 2009, Pages

  Huerta Garrido, M E ^a   Pritzker, M D ^a  

^a UNIVERSITY OF WATERLOO   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

ACIDS; ADDITIVES; COPPER; COPPER PLATING; DESORPTION; ELECTROLYSIS; ETHYLENE GLYCOL; GLYCOLS; KETONES; KINETIC PARAMETERS; PARAMETER ESTIMATION; POLYETHYLENE OXIDES; SOLID SOLUTIONS; THERMOPLASTICS;

ACIDIC SULFATE SOLUTIONS; COPPER DEPOSITIONS; DISK ELECTRODES; EXPERIMENTAL DATUMS; IMPEDANCE MODELS; MODEL DEVELOPMENTS; OVERPOTENTIAL; PHYSICOCHEMICAL MODELS; REACTION MECHANISMS; VOLTAMMOGRAM;

POLYETHYLENE GLYCOLS;

EID: 56749091237     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.3010384     Document Type: Article

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