Microstructural characterization of reflowed and isothermally-aged Cu and Ag particulate reinforced Sn-3.5Ag composite solders

Soldering and Surface Mount Technology

Volumn 13, Issue 1, 2001, Pages 7-18

  Guo, F ^a   Choi, S ^a   Lucas, J P ^a   Subramanian, K N ^a  

^a Michigan State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL ANALYSIS; METALLOGRAPHIC MICROSTRUCTURE; MORPHOLOGY; SCANNING ELECTRON MICROSCOPY; SUBSTRATES; TIN ALLOYS;

COMPOSITE SOLDERS; ISOTHERMAL AGING;

SOLDERING ALLOYS;

EID: 0035115391     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540910110361668     Document Type: Article

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