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Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals

Volumn 70, Issue 5, 2006, Pages 427-433

Microstructure of interface between Sn-Cu solder with Ni and Cu plate

(3) Nishikawa, Hiroshi a Piao, Jin Yu b,c Takemoto, Tadashi a

a OSAKA UNIVERSITY (Japan)

b OSAKA UNIVERSITY (Japan)

c Harima Chemicals Inc (Japan)

Author keywords

Interfacial reaction; Intermetallic compound; Lead free solder; Microstructure; Nickel addition; Tin copper solder

Indexed keywords

INTERFACIAL REACTION; INTERMETALLIC COMPOUND; LEAD-FREE SOLDER; NICKEL ADDITION; TIN-COPPER SOLDER;

COPPER; FLOW OF FLUIDS; INTERFACES (MATERIALS); INTERMETALLICS; MICROSTRUCTURE; REACTION KINETICS;

TIN;

EID: 33745743534 PISSN: 00214876 EISSN: None Source Type: Journal
DOI: 10.2320/jinstmet.70.427 Document Type: Article

Times cited : (7)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.