Joint scale dependence of aging kinetics in Sn-Ag-Cu solders

10th Electronics Packaging Technology Conference, EPTC 2008

Volumn , Issue , 2008, Pages 903-909

  Kumar, P ^a,b   Cornejo, O ^b   Dutta, I ^a,b   Subbarayan, G ^c   Gupta, V ^d  

^a Washington State University   (United States)

^b Naval Postgraduate School   (United States)

^c PURDUE UNIVERSITY   (United States)

^d TEXAS INSTRUMENTS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AGING BEHAVIORS; AGING KINETICS; ANALYTICAL MODELS; COARSENING BEHAVIORS; COARSENING KINETICS; ENERGY-DISPERSIVE X-RAYS; JOINT PROPERTIES; MICROSTRUCTURAL COARSENING; RELIABILITY DEMANDS; SCALE DEPENDENCES; SN-AG-CU; SN-AG-CU SOLDERS; SOLDER JOINTS; SOLUBILITY LIMITS; SPATIALLY INHOMOGENEOUS; SURFACE FINISHES;

BRAZING; COARSENING; ELECTRONICS PACKAGING; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; SOLUBILITY; SOLUTE TRANSPORT; TERNARY SYSTEMS; TIN ALLOYS; WELDING;

TIN;

EID: 63049104059     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2008.4763545     Document Type: Conference Paper

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