A comparison of impression and compression creep behavior of polycrystalline Sn

Journal of Materials Science

Volumn 42, Issue 13, 2007, Pages 5182-5187

  Park, C ^a   Long, X ^a   Haberman, S ^a   Ma, S ^a   Dutta, I ^a   Mahajan, R ^b   Jadhav, S G ^b  

^a Naval Postgraduate School ^*  (United States)

^b INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPRESSION TESTING; COMPUTER SIMULATION; CREEP; DISLOCATIONS (CRYSTALS); TIN ALLOYS;

COMPRESSION CREEP; MINIATURIZED IMPRESSION CREEP;

POLYCRYSTALLINE MATERIALS;

EID: 34547301411     PISSN: 00222461     EISSN: 15734803     Source Type: Journal    
DOI: 10.1007/s10853-006-0542-5     Document Type: Article

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