Experiments on the aging of Sn-Ag-Cu solder alloys

Powder Metallurgy

Volumn 48, Issue 2, 2005, Pages 193-198

  Snugovsky, L ^a   Perovic, D D ^a   Rutter, J W ^a  

^a UNIVERSITY OF TORONTO   (Canada)

Author keywords

Aging; Pb free solder; Redistribution of Ag and Cu; Sn Ag Cu solder

Indexed keywords

AGING OF MATERIALS; ENERGY DISPERSIVE SPECTROSCOPY; EUTECTICS; HEATING; METALLOGRAPHIC MICROSTRUCTURE; METALLOGRAPHIC PHASES; PARTICLE SIZE ANALYSIS; SCANNING ELECTRON MICROSCOPY; SOLDERING ALLOYS; TERNARY SYSTEMS;

BALL GRID ARRAYS; INTERDENDRITIC EUTECTIC PHASE; LEAD FREE SOLDER; MICROSTRUCTURAL STABILITY; TERNARY EUTECTIC;

TIN ALLOYS;

EID: 23044453847     PISSN: 00325899     EISSN: None     Source Type: Journal    
DOI: 10.1179/003258905X37620     Document Type: Article

References (9)

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