The influence of self-assembled disulfide additive on the pattern shape by Cu electrodeposition through mask

Journal of Electroanalytical Chemistry

Volumn 609, Issue 2, 2007, Pages 68-74

  Jenq, Shrane Ning ^a   Wan, Chi Chao ^a   Wang, Yung Yun ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

Copper; Electrodeposition through mask; SAMs; SPS; Tapered pattern

Indexed keywords

COPPER; ELECTROCHEMISTRY; ELECTRODEPOSITION; SELF ASSEMBLED MONOLAYERS; SULFUR COMPOUNDS;

ELECTRODEPOSITION THROUGH MASKS; TAPERED PATTERNS;

ADDITIVES;

EID: 35348964620     PISSN: 15726657     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jelechem.2007.06.004     Document Type: Article

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