Copper electroplating technology for microvia filling

Circuit World

Volumn 29, Issue 2, 2003, Pages 9-14

  Lefebvre, Mark ^a   Allardyce, George ^a   Seita, Masaru ^a   Tsuchida, Hideki ^a   Kusaka, Masaru ^a   Hayashi, Shinjiro ^a  

^a SHIPLEY COMPANY   (United States)

Author keywords

Electroplating; Microvias

Indexed keywords

ACIDS; COPPER; COPPER COMPOUNDS; DENSITY (SPECIFIC GRAVITY); ELECTROLYTES; ELECTRONICS PACKAGING; FILLING; POSITIVE IONS; PRINTED CIRCUIT MANUFACTURE; SUBSTRATES; SURFACES; THERMODYNAMIC PROPERTIES;

COPPER ELECTROPLATING; DIRECT CURRENT ACID; HIGH DENSITY INTERCONNECT PACKAGE; MICROVIA FILLING; PERIODIC PULSE REVERSE ACID; PLUGGING TECHNIQUE; THERMAL MANAGEMENT ENHANCEMENT; WIRING DENSITY;

ELECTROPLATING;

EID: 0037251170     PISSN: 03056120     EISSN: None     Source Type: Journal    
DOI: 10.1108/03056120310454943     Document Type: Article

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