A method for microvia-fill process modeling in a Cu plating system with additives

Journal of the Electrochemical Society

Volumn 154, Issue 10, 2007, Pages

  Pohjoranta, A ^a   Tenno, R ^a  

^a AALTO UNIVERSITY   (Finland)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITIVES; COMPUTATIONAL METHODS; ELECTRODES; ELECTROPLATING; MATHEMATICAL MODELS; SURFACE ACTIVE AGENTS;

BIDIRECTIONAL PROCESSES; GALVANOSTATIC CONTROL; MICROVIA FILL PROCESSES;

COPPER;

EID: 34548273694     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2761638     Document Type: Article

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