Investigation of organics adsorption and inclusion at the growing interfaces during the Damascene process

Electrochimica Acta

Volumn 53, Issue 23, 2008, Pages 7004-7011

  Favry, É ^a   Frederich, N ^a,b   Meunier, A ^a,b   Omnes L ^b   Jomard, F ^c   Etcheberry, A ^a  

^a UNIVERSITÉ DE VERSAILLES SAINT QUENTIN EN YVELINES   (France)

^b Rockwood Electronic Materials   (France)

^c LABORATOIRE DES SCIENCES DU CLIMAT ET DE L ENVIRONNEMENT   (France)

Author keywords

Additive Incorporation; Copper; Electrochemical deposition; EQCM; SIMS

Indexed keywords

ADDITIVES; ADSORPTION; CARBON FILMS; CHLORINE COMPOUNDS; COPPER; DEGRADATION; ELECTROLYTES; METALLIC FILMS; METALLIC MATRIX COMPOSITES; QUARTZ CRYSTAL MICROBALANCES; REDUCTION; SECONDARY ION MASS SPECTROMETRY; SILICON WAFERS;

CONTAMINATION LEVELS; COPPER ELECTROPLATING; CORRELATION STUDIES; DEGRADATION MECHANISM; DEPOSITION PARAMETERS; ELECTROCHEMICAL QUARTZ CRYSTAL MICROBALANCE; EQCM; FILM MICROSTRUCTURES;

ELECTROCHEMICAL DEPOSITION;

EID: 48949116133     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.electacta.2008.01.108     Document Type: Article

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