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Volumn 53, Issue 23, 2008, Pages 7004-7011

Investigation of organics adsorption and inclusion at the growing interfaces during the Damascene process

Author keywords

Additive Incorporation; Copper; Electrochemical deposition; EQCM; SIMS

Indexed keywords

ADDITIVES; ADSORPTION; CARBON FILMS; CHLORINE COMPOUNDS; COPPER; DEGRADATION; ELECTROLYTES; METALLIC FILMS; METALLIC MATRIX COMPOSITES; QUARTZ CRYSTAL MICROBALANCES; REDUCTION; SECONDARY ION MASS SPECTROMETRY; SILICON WAFERS;

EID: 48949116133     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.electacta.2008.01.108     Document Type: Article
Times cited : (22)

References (44)
  • 4
    • 48949109986 scopus 로고    scopus 로고
    • A. Preusse, M. Nopper, AMD, Dresden, Germany, Semiconductor Fabtech 26th Edition, Wafer Processing (2005) p. 123.
    • A. Preusse, M. Nopper, AMD, Dresden, Germany, Semiconductor Fabtech 26th Edition, Wafer Processing (2005) p. 123.


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.