Incorporation of sulfur, chlorine, and carbon into electroplated Cu thin films

Microelectronic Engineering

Volumn 84, Issue 1, 2007, Pages 54-59

  Stangl, M ^a   Acker, J ^a   Oswald, S ^a   Uhlemann, M ^a   Gemming, T ^a   Baunack, S ^a   Wetzig, K ^a  

^a IFW DRESDEN   (Germany)

Author keywords

Additive incorporation; Additive surface adsorption; Copper; Electrochemical deposition; Impurities

Indexed keywords

CARBON; CHLORINE; COPPER; ELECTROPLATING; IMPURITIES; PARAMETER ESTIMATION; SECONDARY ION MASS SPECTROMETRY; SULFUR;

ADDITIVE INCORPORATION; ADDITIVE SURFACE ADSORPTION; ELECTROCHEMICAL DEPOSITION;

THIN FILMS;

EID: 35348886572     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2006.08.004     Document Type: Article

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