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Volumn 70, Issue 2-4, 2003, Pages 461-469

Electrochemical aspects of new materials and technologies in microelectronics

Author keywords

Copper; Electrochemical technologies; Scaling

Indexed keywords

DIELECTRIC MATERIALS; ELECTROCHEMISTRY; ELECTROPLATING; LEAKAGE CURRENTS; PERMITTIVITY; SELF ASSEMBLY; TRANSISTORS;

EID: 0142011564     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(03)00420-9     Document Type: Conference Paper
Times cited : (34)

References (20)
  • 3
    • 0041527795 scopus 로고    scopus 로고
    • Intel's 90 nm technology: Moore's law and more
    • Fall
    • M.T. Bohr, Intel's 90 nm technology: Moore's law and more, in: Intel Developer Forum, Fall 2002.
    • (2002) Intel Developer Forum
    • Bohr, M.T.1
  • 20
    • 0034431455 scopus 로고    scopus 로고
    • Materials, Technology, and Reliability for Advanced Interconnects and Low-k Dielectrics K. et al. Maex. Warrendale, PA: Materials Research Society
    • Kuan T., Inoki C.K., Oehrlein G.S., Rose K., Zhao Y.-P., Wang G.-C., Rossnagel S.M., Cabral C. Maex K., et al. Materials, Technology, and Reliability for Advanced Interconnects and Low-k Dielectrics. Mater. Res. Soc. Symp. Proc. 612:2000;D711 Materials Research Society, Warrendale, PA.
    • (2000) Mater. Res. Soc. Symp. Proc. , vol.612
    • Kuan, T.1    Inoki, C.K.2    Oehrlein, G.S.3    Rose, K.4    Zhao, Y.-P.5    Wang, G.-C.6    Rossnagel, S.M.7    Cabral, C.8


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.