Preferential copper electrodeposition at submicrometer trenches by consumption of halide ion

Electrochemical and Solid-State Letters

Volumn 6, Issue 6, 2003, Pages

  Hayase, Masanori ^a   Taketani, Munemasa ^a   Hatsuzawa, Takeshi ^a   Hayabusa, Keisuke ^b  

^a TOKYO INSTITUTE OF TECHNOLOGY   (Japan)

^b EBARA CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BROMINE; CHLORINE; COPPER COMPOUNDS; DIFFUSION; ELECTROPLATING; NEGATIVE IONS; POLYETHYLENE GLYCOLS; SURFACES;

ACID COPPER SURFACE ELECTROPLATING BATH; COPPER ELECTRODEPOSITION; DIFFUSIONAL LIMITATION; HALIDE ION; SUBMICROMETER TRENCHES;

COPPER;

EID: 0038813912     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1568832     Document Type: Article

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