SCOPUS 정보 검색 플랫폼

Surface and Coatings Technology

Volumn 200, Issue 10 SPEC. ISS., 2006, Pages 3112-3116

Investigation of overpotential and seed thickness on damascene copper electroplating

(5) Chen, K W a Wang, Y L b Chang, L a Li, F Y c Chang, S C b

a NATIONAL CHIAO TUNG UNIVERSITY (Taiwan)

b NATIONAL UNIVERSITY OF TAINAN (Taiwan)

c NATIONAL CHUNG HSING UNIVERSITY (Taiwan)

Author keywords

Copper electroplating; Copper seed layer; Overpotential; Plating current density

Indexed keywords

ATOMIC FORCE MICROSCOPY; COPPER; ENERGY DISPERSIVE SPECTROSCOPY; FILMS; GRAIN BOUNDARIES; IMPURITIES; OPTIMIZATION; SCANNING ELECTRON MICROSCOPY; SECONDARY ION MASS SPECTROMETRY; TRANSMISSION ELECTRON MICROSCOPY;

COPPER ELECTROPLATING; COPPER SEED LAYER; PLATING CURRENT DENSITY;

ELECTROPLATING;

ATOMIC FORCE MICROSCOPY; COPPER; ELECTROPLATING; ENERGY DISPERSIVE SPECTROSCOPY; FILMS; GRAIN BOUNDARIES; IMPURITIES; OPTIMIZATION; SCANNING ELECTRON MICROSCOPY; SECONDARY ION MASS SPECTROMETRY; TRANSMISSION ELECTRON MICROSCOPY;

EID: 31644441742 PISSN: 02578972 EISSN: None Source Type: Journal
DOI: 10.1016/j.surfcoat.2005.07.007 Document Type: Article

Times cited : (26)

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