Sulfur incorporation in electroplated Cu(Ag) thin films

Microchimica Acta

Volumn 156, Issue 1-2, 2006, Pages 167-172

  Strehle, Steffen ^a   Reiche, Rainer ^a   Hoffmann, Volker ^a   Acker, Jörg ^a   Gemming, Thomas ^a   Wetzig, Klaus ^a  

^a IFW DRESDEN   (Germany)

Author keywords

Copper silver alloy film; Electromigration; Electroplating; Sulfur impurity

Indexed keywords

EID: 33751441292     PISSN: 00263672     EISSN: 14365073     Source Type: Journal    
DOI: 10.1007/s00604-006-0607-9     Document Type: Conference Paper

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