메뉴 건너뛰기




Volumn 2005, Issue , 2005, Pages 679-686

Test connections - Tying application to process

Author keywords

[No Author keywords available]

Indexed keywords

CELL PHONES; CUSTOMER QUALITY; DEFECTIVE PARTS PER MILLION (DPPM); TECHNOLOGY GENERATION;

EID: 33847131369     PISSN: 10893539     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/TEST.2005.1584030     Document Type: Conference Paper
Times cited : (13)

References (38)
  • 1
    • 33847149088 scopus 로고    scopus 로고
    • International Technology Roadmap for Semiconductors
    • "International Technology Roadmap for Semiconductors", http://public.itrs.net/
  • 2
    • 0033740624 scopus 로고    scopus 로고
    • Multi Parameter Method for Yield Analysis and Reliability Assessment
    • Y. Mitnick, "Multi Parameter Method for Yield Analysis and Reliability Assessment", IEEE International Reliability Symposium, 2000, pp. 158-163
    • (2000) IEEE International Reliability Symposium , pp. 158-163
    • Mitnick, Y.1
  • 4
    • 9144274556 scopus 로고    scopus 로고
    • In-Line Defect Reduction From a Historical Perspective and Its Implications for Future Integrated Circuit Manufacturing
    • Nov
    • R. Guldi, "In-Line Defect Reduction From a Historical Perspective and Its Implications for Future Integrated Circuit Manufacturing", Transactions on Semiconductor Manufacturing, Vol. 17, No. 4, Nov. 2004, pp. 629-640
    • (2004) Transactions on Semiconductor Manufacturing , vol.17 , Issue.4 , pp. 629-640
    • Guldi, R.1
  • 5
    • 28744444175 scopus 로고    scopus 로고
    • Estimating DPPM during the Prototype to Product Ramp Phase
    • accepted presentation
    • T. Anderson, "Estimating DPPM during the Prototype to Product Ramp Phase", IEEE Reliability Physics Symposium, 2005, accepted presentation
    • (2005) IEEE Reliability Physics Symposium
    • Anderson, T.1
  • 8
    • 33847109185 scopus 로고    scopus 로고
    • P. Rickert, Internal correspondence
    • P. Rickert, Internal correspondence
  • 9
    • 9144249190 scopus 로고    scopus 로고
    • Yield Learning and the Sources of Profitability in Semiconductor Manufacturing and Process Development
    • Nov
    • C. Weber, "Yield Learning and the Sources of Profitability in Semiconductor Manufacturing and Process Development", Transactions on Semiconductor Manufacturing, Vol. 17, No. 4, Nov. 2004, pp. 590-596
    • (2004) Transactions on Semiconductor Manufacturing , vol.17 , Issue.4 , pp. 590-596
    • Weber, C.1
  • 14
    • 0033741528 scopus 로고    scopus 로고
    • Experimental evidence for voltage driven breakdown models in ultrathin gate oxides
    • P.E. Nicollian, W.R. Hunter, J.C. Hu, "Experimental evidence for voltage driven breakdown models in ultrathin gate oxides", IEEE Reliability Physics Symposium, 2000. pp. 7-15
    • (2000) IEEE Reliability Physics Symposium , pp. 7-15
    • Nicollian, P.E.1    Hunter, W.R.2    Hu, J.C.3
  • 15
    • 0032660955 scopus 로고    scopus 로고
    • ox variations, with applications to process design, circuit design, and end use
    • ox variations, with applications to process design, circuit design, and end use", IEEE Reliability Physics Symposium, 1999, pp. 72-81
    • (1999) IEEE Reliability Physics Symposium , pp. 72-81
    • Hunter, W.R.1
  • 16
    • 0037004808 scopus 로고    scopus 로고
    • Experimental evidence of T/sub BD/ power-law for voltage dependence of oxide breakdown in ultrathin gate oxides
    • Dec
    • E.Y. Wu, A. Vayshenker, E. Nowak J. Sune, R.-P. Vollertsen, W. Lai, D. Harmon, "Experimental evidence of T/sub BD/ power-law for voltage dependence of oxide breakdown in ultrathin gate oxides", IEEE Transactions on Electron Devices, Vol. 49, No. 12, Dec. 2002, pp. 2244-2253
    • (2002) IEEE Transactions on Electron Devices , vol.49 , Issue.12 , pp. 2244-2253
    • Wu, E.Y.1    Vayshenker, A.2    Nowak, E.3    Sune, J.4    Vollertsen, R.-P.5    Lai, W.6    Harmon, D.7
  • 18
    • 0036892397 scopus 로고    scopus 로고
    • Electromigration reliability issues in dual-damascene Cu interconnections
    • Dec
    • E.T. Ogawa, Ki-Don Lee, V.A. Blaschke, P.S. Ho, "Electromigration reliability issues in dual-damascene Cu interconnections", IEEE Transactions on Reliability, Vol. 51, No. 4, Dec. 2002, pp. 403-419
    • (2002) IEEE Transactions on Reliability , vol.51 , Issue.4 , pp. 403-419
    • Ogawa, E.T.1    Ki-Don Lee, V.A.2    Blaschke, P.S.H.3
  • 19
    • 4043122543 scopus 로고    scopus 로고
    • C.D. Hartfield, E.T. Ogawa, Young-Joon Park, Tz-Cheng Chiu, Honglin Guo, Interface reliability assessments for copper/low-k products, IEEE Transactions on Device and Materials Reliability, 4, No. 2, June 2004, pp. 129-141
    • C.D. Hartfield, E.T. Ogawa, Young-Joon Park, Tz-Cheng Chiu, Honglin Guo, "Interface reliability assessments for copper/low-k products", IEEE Transactions on Device and Materials Reliability, Vol. 4, No. 2, June 2004, pp. 129-141
  • 25
    • 0032639191 scopus 로고    scopus 로고
    • Microprocessor Reliability Performance as a Function of Die Location for a 0.25μm, Five Layer Metal CMOS Logic Process
    • W. C. Riordan, R. Miller, J. M. Sherman, J. Hicks, "Microprocessor Reliability Performance as a Function of Die Location for a 0.25μm, Five Layer Metal CMOS Logic Process", IEEE International Reliability Symposium, 1999, pp. 1-11
    • (1999) IEEE International Reliability Symposium , pp. 1-11
    • Riordan, W.C.1    Miller, R.2    Sherman, J.M.3    Hicks, J.4
  • 27
    • 51449088512 scopus 로고    scopus 로고
    • Statistical Post-Processing at Wafersort - An Alternative to Burn-in and a Manufacturable Solution to Test Limit Setting for Sub-micron Technologies
    • R. Madge, M. Rehani, K. Cota, "Statistical Post-Processing at Wafersort - An Alternative to Burn-in and a Manufacturable Solution to Test Limit Setting for Sub-micron Technologies", VLSI Test Symposium, 2002, pp. 69-74
    • (2002) VLSI Test Symposium , pp. 69-74
    • Madge, R.1    Rehani, M.2    Cota, K.3
  • 28
    • 18144367789 scopus 로고    scopus 로고
    • Random and Systematic Defect Analysis Using Iddq Signature Analysis for Understanding Fails and Guiding Test Decisions
    • P. Nigh, A. Gattiker, "Random and Systematic Defect Analysis Using Iddq Signature Analysis for Understanding Fails and Guiding Test Decisions", IEEE International Test Conference, 2004, pp. 309-318
    • (2004) IEEE International Test Conference , pp. 309-318
    • Nigh, P.1    Gattiker, A.2
  • 29
    • 18144391871 scopus 로고    scopus 로고
    • Effectiveness Comparisons of Outlier Screening Methods For Frequency Dependent Defects on Complex ASICs
    • B.R. Benware, R. Madge, C. Lu, R. Daasch, "Effectiveness Comparisons of Outlier Screening Methods For Frequency Dependent Defects on Complex ASICs", VLSI Test Symposium, 2003, pp. 39-46
    • (2003) VLSI Test Symposium , pp. 39-46
    • Benware, B.R.1    Madge, R.2    Lu, C.3    Daasch, R.4
  • 30
    • 18144391597 scopus 로고    scopus 로고
    • Affordable and Effective Screening of Delay Defects in ASICs using the Inline Resistance Fault Model
    • B. Benware, C. Lu, J. Van Slyke, P. Krishnamurthy, R. Madge, "Affordable and Effective Screening of Delay Defects in ASICs using the Inline Resistance Fault Model", IEEE International Test Conference, 2004, pp. 1285-1294
    • (2004) IEEE International Test Conference , pp. 1285-1294
    • Benware, B.1    Lu, C.2    Van Slyke, J.3    Krishnamurthy, P.4    Madge, R.5
  • 34
    • 18144416974 scopus 로고    scopus 로고
    • ATE Value Add through Open Data Collection
    • R. Madge, "ATE Value Add through Open Data Collection", IEEE International Test Conference, 2004, p. 1430
    • (2004) IEEE International Test Conference , pp. 1430
    • Madge, R.1
  • 36
    • 0043175220 scopus 로고    scopus 로고
    • Failure Analysis of 6T SRAM on Low-Voltage and High-Frequency Operation
    • S. Ikeda, Y. Yoshida, K. Ishibashi, Y. Mitsui, "Failure Analysis of 6T SRAM on Low-Voltage and High-Frequency Operation", IEEE Transactions on Electron Devices, 2003, Vol. 50, No. 5, pp 1270-1276
    • (2003) IEEE Transactions on Electron Devices , vol.50 , Issue.5 , pp. 1270-1276
    • Ikeda, S.1    Yoshida, Y.2    Ishibashi, K.3    Mitsui, Y.4
  • 37
    • 0036927879 scopus 로고    scopus 로고
    • The impact of technology scaling on soft error rate performance and limits to the efficacy of error correction
    • R. Baumann, "The impact of technology scaling on soft error rate performance and limits to the efficacy of error correction", International Electron Devices Meeting, 2002, pp. 329-332
    • (2002) International Electron Devices Meeting , pp. 329-332
    • Baumann, R.1
  • 38
    • 18144364021 scopus 로고    scopus 로고
    • th International Test Conference, 2004, October
    • th International Test Conference, 2004, October


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.