메뉴 건너뛰기




Volumn , Issue , 2003, Pages 77-84

Relating Yield Models to Burn-In Fall-Out in Time

Author keywords

[No Author keywords available]

Indexed keywords

FUNCTIONS; RELIABILITY; WEIBULL DISTRIBUTION;

EID: 0142184831     PISSN: 10893539     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (22)

References (12)
  • 1
    • 0026836537 scopus 로고
    • Reliability Defect Detection and Screening During Processing-Theory and Implementation
    • Hance H. Huston and C. Patrick Clarke, "Reliability Defect Detection and Screening During Processing-Theory and Implementation," Proceedings International Reliability Physics Symposium, 1992, pp. 268-275.
    • (1992) Proceedings International Reliability Physics Symposium , pp. 268-275
    • Huston, H.H.1    Clarke, C.P.2
  • 2
    • 0032639191 scopus 로고    scopus 로고
    • Microprocessor Reliability Performance as a Function of Die Location for a 0.25/μ, Five Layer Metal CMOS Logic Process
    • W. Riordan, R. Miller, J. Sherman, J. Hicks, "Microprocessor Reliability Performance as a Function of Die Location for a 0.25/μ, Five Layer Metal CMOS Logic Process", Proceedings International Reliability Physics Symposium, 1999, pp. 1-11.
    • (1999) Proceedings International Reliability Physics Symposium , pp. 1-11
    • Riordan, W.1    Miller, R.2    Sherman, J.3    Hicks, J.4
  • 3
    • 0035680818 scopus 로고    scopus 로고
    • Unit Level Predicted Yield: A Method of Identifying High Defect Density Die at Wafer Sort
    • October
    • Russell Miller, Walter Riordan, "Unit Level Predicted Yield: A Method of Identifying High Defect Density Die at Wafer Sort", Proceedings 2001 International Test Conference, October 2001, pp. 1118-1127.
    • (2001) Proceedings 2001 International Test Conference , pp. 1118-1127
    • Miller, R.1    Riordan, W.2
  • 4
    • 0010401965 scopus 로고    scopus 로고
    • Yield-Reliability Modeling: Experimental Verification and Application to Burn-In Reduction
    • May
    • T.S. Barnett, A.D. Singh, M. Grady, K.G. Purdy, "Yield-Reliability Modeling: Experimental Verification and Application to Burn-In Reduction", Proceedings 2002 VLSI Test Symposium, May 2002, pp. 75-80.
    • (2002) Proceedings 2002 VLSI Test Symposium , pp. 75-80
    • Barnett, T.S.1    Singh, A.D.2    Grady, M.3    Purdy, K.G.4
  • 5
    • 0142144119 scopus 로고    scopus 로고
    • Redundancy Implications for Product Reliability: Experimental Verification of an Integrated Yield-Reliability Model
    • October
    • T.S. Barnett, A.D. Singh, M. Grady, K.G. Purdy, "Redundancy Implications for Product Reliability: Experimental Verification of an Integrated Yield-Reliability Model", Proceedings 2002 International Test Conference, October 2002.
    • (2002) Proceedings 2002 International Test Conference
    • Barnett, T.S.1    Singh, A.D.2    Grady, M.3    Purdy, K.G.4
  • 8
    • 0002322314 scopus 로고
    • Yield Models for Defect Tolerant VLSI Circuits: A Review
    • I. Koren (ed.), Plenum
    • I. Koren and C.H. Stapper, "Yield Models for Defect Tolerant VLSI Circuits: A Review," Defect and Fault Tolerance in VLSI Systems, Vol. 1, I. Koren (ed.), pp. 1-21, Plenum, 1989.
    • (1989) Defect and Fault Tolerance in VLSI Systems , vol.1 , pp. 1-21
    • Koren, I.1    Stapper, C.H.2
  • 9
    • 0027607627 scopus 로고
    • A Unified Negative Binomial Distribution for Yield Analysis of Defect Tolerant Circuits
    • June
    • I. Koren, Z. Koren and C.H. Stapper, "A Unified Negative Binomial Distribution for Yield Analysis of Defect Tolerant Circuits," IEEE Trans, on Computers, Vol. 42, June 1993, pp. 724-437.
    • (1993) IEEE Trans, on Computers , vol.42 , pp. 724-437
    • Koren, I.1    Koren, Z.2    Stapper, C.H.3
  • 11
    • 0032628982 scopus 로고    scopus 로고
    • An Overview of Manufacturing Yield and Reliability Modeling for Semiconductor Products
    • August
    • Way Kuo and Taeho Kim, "An Overview of Manufacturing Yield and Reliability Modeling for Semiconductor Products", Proceedings of the IEEE, Vol. 87, No. 8, August, 1999, pp. 1329-1344.
    • (1999) Proceedings of the IEEE , vol.87 , Issue.8 , pp. 1329-1344
    • Kuo, W.1    Kim, T.2
  • 12
    • 51449088512 scopus 로고    scopus 로고
    • Statistical Post-Processing at Wafersort: An Alternative to Burn-In and a Manufacturable Solution to Test Limit Setting for Sub-micron Technologies
    • May
    • R. Madge, M. Rehani, K. Cota, W.R. Daasch, "Statistical Post-Processing at Wafersort: An Alternative to Burn-In and a Manufacturable Solution to Test Limit Setting for Sub-micron Technologies", Proceedings 2002 VLSI Test Symposium, May 2002, pp. 69-74.
    • (2002) Proceedings 2002 VLSI Test Symposium , pp. 69-74
    • Madge, R.1    Rehani, M.2    Cota, K.3    Daasch, W.R.4


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.